Chipset companies from the United States, Qualcomm said to have solved the problem of its flagship product the Snapdragon 810. A report from China reported that the chipset is no longer too hot keitka operates.
According to one analysis from China said that the overheating was indeed a substantial problem. On Weibo account with the name Old Yao was also added that the problem is considered severe enough it also seems to have been resolved.
Snapdragon 810 also reportedly will begin shipping in mid-March. That is, if TSMC can work more quickly.
Via teknoup
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