The latest speculation about the project. Smartphone modular phone will be present at the exhibition MWC 2015 in Barcelona next. 50 modular components diusungnya reportedly will adorn the prestigious exhibition. Hopefully, it will show the performance of smartphones in the event.
Ara Project will allow the user to upgrade the camera, RAM, GPU, and even other components by simply removing the old part and replace it with a new one. Wednesday, Toshiba announced that the company has partnered with the Gujarat Einfochips chipset manufacturers will produce chipsets for the Ara Project.
Senior Vice President and Chief Technology Officer of Toshiba, Shardul Kazi said that his company has designed two different versions. The version that is Spiral Spiral One and Two. As for the version Spiral Three will be launched after two previous versions offered to consumers.
Shardul Kazi also add that cost to the modular part will range from $ 50 (about USD. 638ribu) to $ 500 (around Rp.6.4juta). However, the price range will be adjusted to a reasonable price for users later.
Via teknoup
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